Based on Silicon Labs' award-winning EFRB32BG22 SoC, the BGM220S SiP and BGM220P PCB Bluetooth LE modules offer unmatched performance, security, and reliability to support high-volume, battery powered IoT products running on Bluetooth networks.
LE Audio is the latest generation of Bluetooth audio, utilizing Bluetooth Low Energy (BLE) to offer product developers and consumers with the most advanced Bluetooth audio solution to date. Find out how LE Audio compares to the original Classic Audio.
Wi-Fi 6 has brought about a new wave of Wi-Fi strength - offering faster internet speeds, improved battery life, higher security, and backwards-compatibility. But what does 2021 have in store with the release of the new Wi-Fi 6E?
