The Ultimate Accelerator for Market-Ready Solutions
About Jari Haiston
When it comes to electronics engineering, developers consistently strive for the most up-to-date, dependable, high-performance innovations to expedite their time-to-market goals. With a 38-year heritage, Laird Connectivity, a prominent player in the field of wireless connectivity and IoT solutions, has answered the demand for accelerated time-to-market solutions for nearly four decades. One of their latest innovations, the Tungsten700 SMARC Series, is a line of versatile system-on-modules (SOM) that are game-changers for product designers and developers looking to create market-ready solutions with cutting-edge capabilities.
Meet Laird Connectivity’s Tungsten700 SMARC Series
Powered by the MediaTek Genio 700 processor and Laird Connectivity’s upcoming Sona™ MT320 Wi-Fi 6/Bluetooth 5.3 module, the Tungsten700 SMARC series leverages this integrated synergy to form a robust compute and connectivity platform. When coupled with Laird Connectivity’s new SMARC carrier board, Tungsten700 SMARC solutions double as a single board computer (SBC) that enables expedited product development. The Tungsten700 SMARC Series accommodates demanding applications in industrial IoT (IIoT), vision systems, smart cameras, autonomous/automated robotics and vehicles, industrial tablets and handhelds, smart signage, retail POS, and smart fitness equipment.
Unmatched Power and Performance
The integration of MediaTek’s Genio 700 processor provides Tungsten700 SMARC innovations with an octa-core CPU architecture that features 2 'big core' Arm Cortex-A78 CPUs and 6 'efficiency core' Cortex-A55 CPUs. This combination balances power efficiency with peak computing performance, making it ideal for a wide range of applications.
To complement the CPU, the Genio 700 boasts a highly capable Arm Mali-G57 GPU, providing exceptional graphics performance. Additionally, it offers up to 8GB of quad-channel LPDDR4(X) memory, ensuring smooth multitasking and responsive performance.
Next-Generation AI Capabilities
The integrated MediaTek Genio 700 processor enables next-generation AI capabilities in Tungsten700 solutions as its in-chip AI multi-processor (APU) delivers 4 TOPS (Tera Operations Per Second) performance for Deep Learning (DL), Neural Network (NN) acceleration, and Computer Vision (CV) applications. Combined with support for high-detail cameras up to 32MP at 30fps via an in-chip ISP and MIPI-CSI interface, this integration enables powerful AI-driven applications.
Exceptional Power Efficiency
Additionally, the Tungsten700 SMARC Series is exceptionally power efficient as it benefits from the Genio 700’s advanced TSMC N6 (6nm-class) production process. This efficiency expands possible application opportunities as product designers can explore fanless enclosures and off-grid power solutions. Moreover, the small footprint of Tungsten700 SMARC modules helps minimize Bill of Materials (BOM) and development costs.
Robust Connectivity and Interfaces
The Tungsten700 SMARC Series provides a variety of robust control network interfaces suitable for industrial applications, including SPI, I2C, UART, USB 3.0, PCIe, and Gigabit Ethernet. This rich set of connectivity options ensures seamless integration into a wide range of systems.
Enhanced Wireless Connectivity
For wireless connectivity, the Tungsten700 SMARC modules can be equipped with the Sona MT320 Wi-Fi/BT combo. This provides IEEE 802.11ax 2x2 MIMO Wi-Fi capability and a BT 5.3 radio solution, ensuring reliable and high-speed wireless connectivity. The radio interface is SDIO 3.0, optimizing power usage for wireless communication.
.jpg)
.jpg)
.jpg)
.jpg)
.jpg)
Flexible Memory Configurations
The Tungsten700 SMARC Series offers several product SKUs with different eMMC and LPDDR4 memory configurations, allowing you to choose the configuration that best suits your project's needs.
Future-Proof Design
Laird Connectivity's Tungsten700 SMARC modules are designed for the future. They’re built to be easily upgraded to the latest processors and wireless technologies as new SMARC SOMs are released. This forward-looking approach ensures that your product remains competitive and relevant in the ever-changing tech landscape.
Tungsten700 Key Features and Benefits:
Laird Connectivity’s Tungsten700 Series is accelerating developers’ time-to-market through a wide range of key features, including:
- DisplayPort Interface (DPTX)
- Compliance with DP v1.4 standard
- Up to 4K2K @ 60 Hz resolution (10-bit)
- HDMI Transmitter (HDMITX)
- Compressed lossless audio according to HDMI 2.0
- High-bandwidth Digital Content Protection (HDCP) 1.4/HDCP 2.3 function
- Up to 4K2K @ 60 Hz resolution
- Support Consumer Electronics Control (CEC) function
- Embedded DisplayPort Interface (EDPTX)
- eDP v1.2 standard compliant
- Up to 5.4 Gbps per lane
- Up to 1920x1440 @60Hz
- MIPI Display Serial Interfaces (2x 4-lane DSI)
- Throughput up to 1.2 Gbps per data lane
- Compliance with MIPI D-PHY Specification v1.2
- Compliance with MIPI C-PHY Specification v1.0 Imaging
- Camera Image Signal Processing (ISP)
- Single camera: 32MP @ 30fps
- Dual camera: 16MP + 16MP @ 30fps
- Video High Dynamic Range (HDR) with stagger HDR sensor: up to 16 MP at 30 fps
- Face Detection (FD)
- Input image formats:
- YUV420: 2 plane
- YUV422: 2 plane (Y/UV, Y/VU)
- YUV422: 1 plane (YUYV, YVYU, UYVY, VYUY)
- YUV to RGB888 format conversion
- Image up/down-scaling
- Maximum resize width: 640 pixels
- Camera Serial Interface (CSI)
- MIPI D-PHY Specification Revision 2.1
- MIPI C-PHY Specification Revision 1.2
- Primary CSI-2 interface (CSI0), can be used in the following configurations:
- One 4-data lane interface in D-PHY mode, or
- Two 2-data lane interfaces in D-PHY mode, or
- One 3-trio interface in C-PHY mode, or
- Two 2-trio interfaces in C-PHY mode
- Secondary CSI-2 interface (CSI1), can be used in one of the following configurations:
- One 4-data lane interface in D-PHY mode, or
- One 3-trio interface in C-PHY mode
- Pixel formats: RAW8/RAW10/RAW12/RAW14/YUV422 8-bit Audio
- Two I2S interfaces
- Cadence® Tensilica® HiFi 5 Audio Engine Digital Signal Processor (DSP) Connectivity
- One PCI Express (PCIe) Gen2 Single Lane
- Two USB 3.0 Host interfaces (also supports USB 2.0)
- Two USB 2.0 Host interfaces
- One USB 2.0 OTG interface
- One Ultra Secure Digital Host Controller interface
- Two Gigabit Ethernet controller (1x RGMII, 1x USB)
- Three Universal Asynchronous Receiver/Transmitter (UART) modules
- Five I2C modules
- Three SPI modules Security
- Arm® TrustZone® (TZ) architecture Debug Interface
- Secure JTAG Controller (SJC)
- Debug UART port RF output
- Two RF output with U.FL connectors provide flexible external antenna selection for optimized performance
- Main antenna: Support both Wi-Fi and BT
- Aux Antenna: Support Wi-Fi only
- DisplayPort Interface (DPTX), Compliance with DP v1.4 standard, Up to 4K2K @ 60 Hz resolution (10-bit)
- HDMI Transmitter (HDMITX), Compressed lossless audio according to HDMI 2.0, High-bandwidth Digital Content Protection (HDCP) 1.4/HDCP 2.3 function, Up to 4K2K @ 60 Hz resolution, Support Consumer Electronics Control (CEC) function
Conclusion
In conclusion, the Tungsten700 SMARC Series by Laird Connectivity is the ultimate accelerator for market-ready solutions. With its remarkable performance, AI capabilities, power efficiency, multimedia prowess, and extensive connectivity options, it provides the tools needed to create cutting-edge products and stay competitive in today's fast-paced tech industry. Whether you're developing for industrial or commercial markets, the Tungsten700 SMARC Series is a reliable, future-proof choice that can take your projects to the next level.
Featured Products
About Jari Haiston
Subscribe
Stay up to date with industry and supplier news!