From Micronas: "TDK showcases extensive portfolio of sensors at Sensors Expo & Conference 2018"
TDK Corporation (TSE: 6762) and TDK group companies (EPCOS, TDK-Micronas, InvenSense, Tronics, Hutchinson Technology Inc. (HTI) and Chirp Microsystems) will present the industry’s single source of innovative sensor solutions in Booth 416 at the Sensors Expo & Conference 2018, June 26-28, in the McEnery Convention Center, San Jose, CA.
As the demand for sensor technologies grows across industries, TDK delivers a comprehensive range of sensor solutions applicable to the Internet of Things (IoT), Industry 4.0 and well-established automotive and industrial application fields. This expanding portfolio of offerings covers sensing temperatures, pressures, currents, and magnetic fields.
Product highlights include:
TDK TMR Angle Sensor: The new TAD2140 sensor provides the industry’s highest accuracy for angle error. Its compact size is suited for applications with limited available space, such as steering motor commutation in the automotive industry.
InvenSense Motion and Sound Sensor: InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones, with proprietary algorithms and firmware that intelligently process, synthesize and calibrate the output of sensors, maximizing performance and accuracy. At Sensors Expo, InvenSense will showcase analog and digital MEMS microphone solutions and 6-axis (gyroscope and accelerometer) technologies.
Micronas Magnetic Sensors and Embedded Motor Controllers: The HAR 379x sensors for multidimensional (2D and 3D) magnetic field measurements, suitable for automotive and industrial applications, provide versatile programming characteristics. Additionally, TDK-Micronas will show the complete Hall-effect sensor portfolio as well as the HVC4223F embedded motor controller for the flexible drive of small BDC/BLDC and stepper motors.
EPCOS Temperature Sensors and Elements: The new H650 sensor element is based on a glass-encapsulated high-temperature ceramic sensor element, and is designed for measuring temperatures up to 650 °C. The NTC sensor element offers high-precision measurement with a temperature tolerance of about ±1 K at 200 °C.
EPCOS Pressure Sensors: Designed for pressure ranges of 100 mbar up to 40 bar and available in sizes of 0.65 mm x 0.65 mm up to 2.00 mm x 2.00 mm, these high-performance pressure sensor elements set new benchmarks for automotive applications.
Tronics High-performance MEMS Accelerometer: The new AXO215 closed-loop accelerometer combines key benefits in size, weight and power on a single chip. Tronics will also display inertial sensors and diagnostic chips demonstrations.
HTI Custom NFC Solutions: Customizable NFC solutions enable sealed, encrypted, wireless communications for product authentication, proper install verification and product use history.
HTI Custom Integrated Sensors and Actuators on Flex: In-package sensors are fabricated into flexible circuitry and integrated onto micro-mechanical structures. Shape memory or piezo actuators as well as MEMS and CMOS ICs can also be accommodated with custom chip package designs.
Chirp Microsystems MEMS Ultrasonic ToF Sensors: On display will be MEMS ultrasonic ToF sensors for distance, presence and proximity sensing capabilities. Chirp sensors are offered as a single chip sonar in a tiny package enabling optimal industrial design. They feature ultralow power and high precision range measurement.
Conference: Dr. Rakesh Sethi, vice president, general manager R&D, TDK U.S.A. Corporation, will present on “Future Wearables and Effective Space-Time Continuum: Monitoring of the Human Condition,” from 10:00 – 10:50 a.m. on Thursday, June 28. Dr. Sethi’s session will focus on the low adoption rate of wearables in today’s remote and clinical monitoring spaces. He will discuss the requirements for future diagnostic and predictive systems’ capabilities. This session will review several use cases of upcoming sensor systems for better disease detection modalities.