Laird Connectivity Sterling™ IoT Development Kits

Laird Connectivity’s Sterling™ IoT development kits are scalable, cost-friendly tools to conveniently prototype a wide variety of commercial and industrial IoT applications including temperature sensing, motion/impact, proximity, door open/closed reporting, and more. Operational out of their packaging, Sterling IoT development kits streamline time-to-market and decrease development risk.

Laird Connectivity Sterling-LWB™ Development Boards

Laird Connectivity Sterling-LWB™ WiFi/802.11 development boards support a convenient method of combining Wi-Fi and Bluetooth Low Energy (BLE) v4.2 connectivity in one microcontroller (MCU)-based device. Supporting development and evaluation of Sterling LWB modules, Sterling-LWB development boards provide SD card form factor for convenient connectivity with NXP i.MX 6 and other platforms. Operating at 2.4 GHz, Sterling-LWB development boards are validated with the STM32F411 and can be migrated to other popular MCUs. Additionally, the reference platform for Sterling-LWB development boards features a carrier board for simple connectivity with the STM32F411 Discovery Kit. Laird Connectivity’s Sterling-LWB development boards also feature:

• An external U.FL port or Chip Antenna connector
• Comprehensive support documentation and software examples through TiWiConnect™ & ModuleLink™ mobile applications
• WICED™ SDK by Cypress

Laird Connectivity Sterling EWB Development Kits

Designed to operate in conjunction with Cypress WICED® SDK, Laird Connectivity’s Sterling EWB development kits come equipped with a development board, USB cable4, and an external 2.4 GHz dipole antenna. Sterling EWB development kits evaluate the 451-00001 integrated chip antenna module. Additionally, Laird Connectivity’s Sterling EWB development kits feature am intuitive AT command set for development, configuration, and deployment of applications for host MCUs.

Laird Connectivity Sterling SIPT Development Kit

Laird Connectivity’s 60-SIPT development kit is one of two models that highlight Laird Connectivity’s 60-series SIPT module. The 60-SIPT development kit is a universal development tool that provides rapid wireless connectivity with multiple options for Wi-Fi and Bluetooth application development. Laird’s 60-SIPT development kit features:

• Laird Connectivity’s 60-SIPT module
• Laird Connectivity’s 60-SIPT module
• Power supply options including USB, External DC supply, SDIO interface, and PCIe interface
• Regulated 3.3 V for powering the SIPT module
• USB interface for Wi-Fi or Bluetooth
• SDIO interface for Wi-Fi or Bluetooth
• PCIe interface for Wi-Fi
• UART interface for Bluetooth

Interested in incorporating a Laird Connectivity solution to enhance you IoT application prototype? Contact Symmetry Electronics today!